Pascale Gouker

LL - Senior Staff
Department
Lincoln Laboratory
Technology Areas
Electronics & Photonics: Semiconductors
Impact Areas
Connected World, Advanced Materials

Technologies

Structures, Compositions and Fabrications of Microbump Based Interconnect Technology for High Density Packaging

Technology / Case number: #17465L
Leonard Johnson / Pascale Gouker / Rabindra Das / Ryan Johnson / Mark Gouker
Technology Areas: Electronics & Photonics
Impact Areas: Connected World, Advanced Materials
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